6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping, RELIFE TO6

1. Pure copper gold-plated needle, tinning speed increased by 50%
2. Ball head design, can go deep into the gap, quickly complete the row of pins drag tin, and not easy to scratch the motherboard
3. Containing 5 tin dragging pins, even/fast, full of tin
4. Can be easily operated in small space, not easy to scratch the inline holder
5. Suitable for motherboard maintenance tin drag, especially suitable for BGA package chip tin drag
6. Size: Handle about 11.8 x 0.8cm, Needle about 2 x 0.12cm
7. Net weight: about 21.4g