BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb

1. Crafted with high-quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications.
2. Made with halide-free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks.
3. No-Clean, Low-Residue Efficiency: Minimal post-welding residue eliminates the need for cleaning, saving time and reducing workflow steps. Perfect for high-precision tasks like smartphone and PC motherboard repairs.
4. 25-45μm Micro Particles for Precision: Ultra-fine particle size (25-45μm) ensures smooth tin loading and even distribution, preventing issues like bridging, tin beads, or cold joints. Ideal for densely packed BGA chips and micro components.
5. Advanced Membrane Removal Technology: Optimizes efficiency with reduced mesh scraping during application, improving workflow speed. Enhances solder joint brightness, adhesion, and conductivity for professional-grade results.